Additive manufacturing to integrate sensor structures into mechatronic systems

The collective research project “PrESens” examines the manufacturability and integration of resistive sensors (strain, temperature) by means of printing technologies in industrial components.

Project leader: Prof. Marcus Reichenberger
Researcher(s): Jewgeni Roudenko, M. Sc.
Funded by: Collective Industrial Research
Period: 1 Oct 2020 - 30 Sept 2022

Production of moulded interconnected devices using high-build printing for densely packed high-performance applications

Evaluation and selection of suitable printing technologies and appropriate printing and substrate materials, and the development of suitable packaging and connection technologies for surface-mounted passive and active electronic construction elements on moulded components.

Project leader: Prof. Marcus Reichenberger, Dr Ing.
Researcher(s): Hümmer, Michael, M.Sc.
Funded by: ZIM/BMWi
Period: 1 April 2020 - 30 April 2022