“Mechatronic integrated device” (MID) technology not only enables free-form surfaces to be used as circuit carriers, it also allows further mechanical, electronic, optical, and other functions to be integrated into the polymer base body of the device. There is a potential for considerable savings thanks to the high degree of design freedom for the injection-moulded body and its property as a multi-functional carrier for electronic circuits. These savings can be attributed to reduced assembly costs, for example. The complex structuring and metallisation of the dielectric MID base bodies for generating the model still remain an obstacle to the use of such mechatronic modules. Among other things, the structural resolution of the available process technologies is too low, or else they require significant capital investment or cannot generate the required layer thicknesses. The fact that suitable Ag and Cu pastes are now commercially available, in combination with further developments in integrating functions into components using printing technologies, results in a promising new approach, which is to be implemented within the framework of the DD-MID project. Electrically resilient, mechanically stable and solderable conductor structures are to be created on injection-moulded base bodies by applying commercially available printing pastes (filled with Ag or Cu particles). While screen printing is used as an application method for 2D process surfaces, a jet method is suitable for free-form surfaces. The printing process is followed by a suitable curing process and the assembly and contacting of the requisite electronic components by means of reflow soldering. If successful, the developed process will be implemented on an industrial scale by the medium-sized cooperation partner. The aim is to achieve a process chain that is as short as possible, saves resources, and reduces investment costs.

Project leader: Prof. Marcus Reichenberger

Researcher: Michael Hümmer, M.Sc.

Funded by: ZIM/BMWi

Dates: 1 April 2020 – 30 June 2022